Technical Capability
Process Capability
| No. | Item | Capability |
|---|---|---|
| 1 | Layer count | 2-16 |
| 2 | Max finished size | 1-2L:630x2100mm MaxM/L:630x1250mm Max |
| 3 | Via / PTH annular ring size | ≥4mil(0.1mm)/5mil(0.13mm) |
| 4 | Max PTH hole diameter | ≤6.5mm |
| 5 | Min line width / spacing | 3mil/3mil (0.075mm/0.075mm) |
| 6 | Min inner layer pad | 4mil (0.1mm) |
| 7 | Min inner layer thickness | 4mil (0.1mm) |
| 8 | Inner layer copper thickness | 0.5-2.0 oz |
| 9 | Hole copper thickness | 18-30um |
| 10 | Lead-free HASL tin thickness | 150-1000u' (3.75-25um) |
| 11 | Outer layer finished copper | 0.5-5.0 oz |
| 12 | Finished board thickness | 0.2-3.2mm (4L:0.5mm Min) |
| 13 | Board thickness tolerance | ±10% |
| 14 | Multilayer registration | ±2mil (±50um) |
| 15 | Min drilled hole | 0.15mm |
| 16 | Hole position accuracy | ±2mil (±50um) |
| 17 | Hole diameter tolerance | ±2mil (±50um) |
| 18 | Max plating aspect ratio | 10:1 |
| 19 | Outer PAD registration | 3mil/3mil (0.075mm/0.075mm) |
| 20 | Etching tolerance | ±10% |
| 21 | Min solder mask dam width | 3mil (0.075mm) |
| 22 | Max solder mask plug hole | 0.5mm |
| 23 | Surface finish | HAL/HALLF, ENIG, OSP, Immersion Tin, Gold finger |
| 24 | Max gold finger plating thickness | ≤30u' (≤0.75um) |
| 25 | ENIG thickness | Au1-3u" Ni:100-300u |
| 26 | Impedance control tolerance | ±10% |
| 27 | Max board warpage | ≤0.75% |